PVD |
CVD |
| Performed
in a vacuum (10-2 to 10-4 Torr) |
Performed
in a controlled atmosphere |
Low
process temperature (200°-800°F) |
High
temperature process (1900°F) |
Line
of sight process
|
Reactive
gas process coats wherever atmosphere contacts surface
|
Coating
exhibits a physical bond to the substrate |
Diffusion
bond to substrate (much stronger than PVD’s physical
bond)
|
Average
thickness: 2-5 µm, or .00008-.0002”
|
Average
thickness: 6-10 µm, or .00024-.0004”
|
Suitable
for a wide range of substrates
|
Smaller
range of appropriate substrates
|
Ideal
for closely toleranced components
(+/- .0001” is appropriate)
|
Requires
relatively loose tolerances
(example: +/-.0005” per 1.0” diameter) |
No
heat-treating required
|
Post-coating
heat-treating required on steel components
|
| Good
for sharp edges: no excessive coating build-up |
Requires
hone on cutting edges due to coating build-up |
| This
process has the ability to coat mirror finishes without
any post-coating polishing |
Difficult
to maintain mirror finish (post-coating polishing will
improve finish beyond 4 µm.) |